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RK35 Series
RK33 Series
RK32 Series
RK31 Series
RK30 Series
RK18 Series
RK MCU Series
RK Power Series
RV11 Series
Rockchip Module
RK8 Series
RK6 Series
RK2206
典型应用方向
主要特性
- Cortex-M4F Up To 200MHz
- Tensilica HiFi3 DSP Up To 300MHz
- Built-in 448K Byte SRAM & DTCM
- Embedded 8M/4M Byte FLASH & PSRAM
- WLAN 802.11 b/g/n
| SPECIFICATIONS | |
| CPU | • Cortex-M4F Up To 200MHz |
| DSP | • Tensilica HiFi3 DSP Up To 300MHz |
| Memory | • Built-in 256KB SRAM，192KB DTCM |
| • Built-in 8/4 MB Flash | |
| • Built-in 8/4 MB PSRAM | |
| • Support EMMC,SD/MMC Card | |
| Audio ADC | • 3CH Audio-ADC,1CH Audio-DAC (With-in RK812) |
| • Class D Audio PA(With-in RK812) | |
| Connectivity | • Built-in Power Management(With-in RK812) |
| • DVP Sensor Interface | |
| • USB2.0 OTG, SPI, UART，I2C，PDM, I2S | |
| Display | • MCU/SPI LCD Interface |
| Audio | • Multi-format audio encoder & decoder |
| OS | • Free RTOS |